Nickel and Gold Electroplating

• Automated Process available for larger parts and quantities

• Solderable surface

• Bondable gold available

• Panel plate small circuits with edge connectors

Nickel Plate

We provide a low stress satin nickel plated from a sulfamate nickel plating solution. 
Nickel plating serves several functions: First it is a barrier layer which prevents the diffusion of copper into the gold top layer. If the copper is diffused into the gold the electrical characteristics (i.e. contact resistance), corrosion resistance of the contact will be degraded. Second, it is also used as a barrier between tin and copper to prevent the formation of copper-tin intermettallics. This can be important when the product must operate in high temperature environments. The third function of the nickel layer is, it prevents the copper layer from physically deforming with repeated insertions of the contacts.

Gold Plate

Gold plating has excellent electrical and thermal conductivity, it offers exceptional solderability and is a superb reflector of infrared radiation. In addition, gold is a noble metal that does not oxidize or chemically react under normal conditions. We can provide two different types electrolytic gold plate. Each serves a different purpose;

Hard Gold

The first type is known as "hard" gold. It is usually used for contacts such as edge board connectors or a key pad. The hard gold we use is also a solderable gold. The thickness specified for contacts is .8 microns (30 microinches) minimum or 1.3 microns (50 microinches minimum). The thickness specified for solderability should be a maximum of .8 microns (30 microinches).

This gold meets the requirements of Mil-G-45204, type I or type II, grade C. It also meets the requirements ASTM B-488-01, type I or type II, code C.

Soft Gold

The other type is known as "soft" or "bondable" gold. This gold is specified when the assembly operations require wire bonding with gold wire. The purity and hardness of bondable soft gold must be closely monitored and controlled. The hardness must be 90 Knoop (25g load) or less. The purity must be 99.7% or greater to meet Type I requirements and 99.9% or greater to meet Type III requirements.

In the past, wire bonding with gold wire was thought to require a relatively thick deposit. It was often specified at 100 microinches minimum. Advancements in wirebonding equipment and technique now allow bonding to be performed at a thickness as low as .3 microns (12 microinches), however most still specify 1.3 microns (50 microinches) minimum.

This gold meets the requirements of Mil-G-45204, type III, grade A. It also meets the requirements of ASTM B-488-01, type III , Code A.

The service we provide can be applied to your parts in one of the following ways.

We can pattern plate the whole panel. We need to receive the panel after your copper plating operation, with the photo-resist still on the panel. There should not be any tin or tin-lead exposed.

Selected areas internal to the circuit can be plated. The most frequent way this is accomplished is: After you plate your parts with copper and tin, a second image is applied that only shows the areas that require gold. Strip the exposed tin before sending us your parts.

For more information on any of our services, please feel free to contact us.