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Immersion Silver

Hot air solder level alternative
Flat Solderable Surface allows tight placement of surface mount devices
More cost effective than immersion gold

 

We deposit immersion silver on your copper circuitry according to IPC-4553 which was updated to revision A in June of 2009. The specification call out a thickness range of 5 - 16 micro-inches. The nominal thickness of the deposit will be 8 to 12 micro-inches. Other thickness ranges, up to 30 micro-inches, are possible though not recommended. The deposit is flat and uniform and has a very long shelf life. It will withstand multiple heat cycles in assembly, which can be problematic with traditional organic coatings (OSP).

Recommendations and Limits

We can plate panels up to 24" x 36"

The process is designed to plate the pads only after solder mask is applied.

We plate panels that have many different brands of solder mask and do not recommend any particular brand or model. However, please follow closely any recommendations that your mask supplier has regarding panel preparation prior to applying the solder mask.

For more information on any of our services, please feel free to contact us.